A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

A

ADC: Analog-to-Digital Convertor
AES : Auger Electron Spectroscopy
AFM : Atomic Force Microscope
AGC: Automatic Gain Control
AI Artifical Intelligence
AR: Aspect Ratio
ASIB: Application Specified Interconnection Board
ASIC: Application Specified Integrated Circuit
ATAB: Area (Array) Tape Automated Bonding

B

BCA: Bare Chip Attach
BCP: Bare Chip Processing
BEM: Boundary Element Method
BGA: Ball Grid Array
BIST: Built In Self Test
BME: Base-Metal Electrodes
BS: Boundary Scan
BTAB: Bumped Tape Automated Bonding

C

C&W: Chip and Wire
CAIBE: Chemically Assisted Ion-Beam Etching
CAD: Computer-Aided Design
CAE : Computer-Aided Engineering
CAM: Computer-Aided Manufacturing
CC: Chip Carrier
C-C: Chip Capacitor
CCC: Ceramic Chip Carrier
CCD: Charge Coupled Device
CIB: Chip in Board
CMOS: Complementary Metal-Oxide Semiconductor
COB: Chip on Board
COG: Chip on Glass
CQFP: Ceramic Quad-Flat Package
C-R: Chip Resister
CSP Chip Scale Package, Chip Size Package
CVD: Chemical Vapor Deposition
CXC: optical cross connect

D

DBGA: Dimpled Grid Array
DCA: Direct Chip Attachment
DEMA : Distributed Electromechanical Actuator
DFP: Dual Flat Pack
Die: (gleiche Bedeutung wie Chip)
DIL: Dual in-Line
DIP: Dual in-Line Package
DI-Tran: Dielectric Transfer Tape
DRAM: Dynamic RAM
DRC: Direct Robot Control
DSB: Double-Sided Board 
DEMA: Distributed Electromechanical Actuator
DP: Differential Pressure

E

EDM : Electro-Discharge Machining
EM: Electro-Magnetic
ELSI: Extra (Extremely) Large Scale Integration

F

FC: Flip Chip
FCIP: Flip Chip in Package
FC: Flip Chip Technology
FIB : Focused Ion Beam
FEM: Finite Element Method
FMS: Flexible Manufacturing System
FOF: Film on Frame, Factory of the Future
FP: Flat Package, Flatpack
FPY: First Production Yield
GSI: Giant Scale Integration

H

HDI: High Density Interconnection
HDMI: High Density Multilayer Interconnect
HF: Hydrofluoric Acid
HIC: Hybrid Integrated Circuit
HSIC: High Speed Integrated Circuit
HVAC: Heating, Ventilation, and Air Conditioning

I

IBE Ion-Beam Etching
IC: Integrated Circuit
ICT: In Circuit Test
IE: Ion Etching
I2L: Integrated Injection Logic
ILB: Inner Lead Bonding
IMD: Insert Mounted Device
IMT: Insert Mount Technology
IP: Intellectual Property
IR: Infra-Red
ISFET: Ion-Sensitive Field Effect Transistor

J

JIT: Just-in-Time

K

KGD: Known Good Die
KOH-Based: Potassium Hydroxide-Based

L

LAD Laser Assisted Deposition
LAN: Local Area Network
Laser: Light Amplification by Stimulated Emission of Radiation
LIGA: Lithography Galvanoformung Abformung (a process based on lithography, electroplating, and molding)LIF: Low Insertion Force
LPCVD: Low Pressure CVD
LSI: Large Scale Integration

M

MC: Multilayer Ceramic
MCB: Molded Circuit Board
MCD-D: Multichip Module Deposited
MCM: Multilayer Ceramic Module, Multichip Module
MCM-C: Multichip Module Ceramic
MCM-L: Multichip Module Laminated
MCNC: Microelectronics Center of North Carolina
MCP: Multichip Package
MELF: Metal Electrode Face Bonding
MEMS: Micro-electro-mechanical Systems
MID: Moulded Interconnect Device
MIPS: Million Instructions per Second
MIR: Moisture Insulation Resistance
MIS: Microinterconnect System
MLB: Multilayer Board
MLC: Multilayer Ceramic
MLCC: Multilayer Ceramic Chip Capacitor
MLE: Molecular Layer Epitaxy
MLI: Multilayer Interconnections
MLS: Multilayer Substrate
MOEMS: Micro-opto-electro-mechanical systems
MOP: Metal Based Organic Film Packaging
MOS: Metal Oxide Semiconductor MPS: Micro Packaging System
MSI: Medium Scale Integration
MST: Micro System Technology
MSP: Mimi Square Package
µBGA: Micro Ball Grid Array

N

NETD: Noise Equivalent Temperature DifferenceNMOS: N-Channel Metal Oxide Semiconductor (a transistor technology)

P

PAA: Pad Area Array Package
PAT: Packaging, Assembly and Testing
PB: Printed Board
PC: Printed Circuit, Personal Computer
PCB: Printed Circuit Board
PCC: Plastic Chip Carrier
PCM: Photoformed Ceramic Module
PCS: Photoformed Ceramic Substrate
PE: Plasma Etching
PGA: Pin Grid Array, Pad Grid Array
Piezoactuator : An actuator typically producing a force or displacement in response to an electrical input signal
PIH: Pin in Hole (Technology)
PLD: Programmable Logic Device
POM: Polymer on Metal
ppm: Parts per Million
PQFP: Plastic Quad-Flat Package
PSMD: Photoselective Metal Deposition
PTH: Plated-Through Hole
PWA: Printed Wiring Assembly
PWB: Printed Wiring BoardPiezoactuator : An actuator typically producing a force or displacement in response to an electrical input signal

Q

QCP: Quad Carrier Package
QFP: Quad-Flat Package
QUIL: Quad in-Line
QUIP: Quad in-Line Package, Quadruple in-Line Package

R

RAM: Random Access Memory
RAMS: Reliability, Availability, Maintainability, and Safety –
RDT: Rotary Displacement Transducer
RF: Radio FrequencyRIBE: Reactive Ion-Beam Etching
RIE: Reactive Ion Etching
ROM: Read only Memory

S

SAS : Sensors, Actuators, and Subsystems
SCB: Silicon Circuit Board
SCP: Single Chip Packaging
SEM: Scanning Electron Microscope
SHSIC: Super High Speed IC
SIL: Single in-Line
SIP: Single in-Line Package
SLAM: Single Layer Alumina Metallization
SLSI: Super Large Scale Integration
SMA: Shaped Memory Alloy
SMA Surface Mount Assembly
SMART: Surface Mounted and Related Technologies
SMC: Surface Mounted Component
SMD: Surface Mounted Device
SME: Surface Mount Equipment
SMOBC: Solder Mask over Bare Copper
SMP: Surface Mounted Package
SMT Surface Mount Technology
SOI : Silicon-on-Insulator
SOI: Semiconductor on Insulator
SO: Small Outline
SOIC: Small Outline IC
SOP: Small Outline Package
SOS: Silicon on Sapphire
SOT: Small Outline Transistor
SO-W: Small Outline Width
SPC: Statistical Process Control
SRAM: Static Random Access Memory SSB: Single-Sided-Board
SSI: Small Scale Integration
SSOP: Shrink Small Outline Package

T

TAB: Tape Automated Bonding
TC: Thermocompression
TCB: Thermo Compression Bonding
TCC: Tape Chip Carrier
TCE: Thermal Coefficient of Expansion, Temperature Coefficient of Expansion
TCM: Thermal Conduction Module
TCP: Tape Carrier Package
TFT: Thin Film TransistorTg: Glass Transistion Temperature
THM: Through Hole Mounting
THT: Through Hole Technology
TMP: Thermal Mounting Plate
TOS: Tape on Substrate
TS: Thermosonic
TSOP: Thin Small Outline Package
TTL: Transistor-Transistor Logic

U

UBM: Underbump Metallization
UFP: Ultra fine pitch
ULSI: Ultra Large Scale Integration
US: UltrasonicUV: Ultraviolet

V

VHSIC: Very High Speed IC
VIP: Vias in Pad
VLSI: Very Large Scale Integration
VPS: Vapour Phase Soldering
VSM : Very Small MachinesVSO: Very Small Outline

W

WEDG: Wire Electric Discharge GrindingWLBI: Wafer Level Burn In
WLB: Wafer Level Packaging
WSI: Wafer Scale Integration

Z

ZIF: Zero Insertion Force
ZIP: Zig Zag in-Line Package