MetalMUMPs was introduced to the market in 2003. As with SOIMUMPs, the process for MetalMUMPs was an offspring of a MEMSCAP product - in this case, a microrelay - though the process today has been refined to make it more "multi-user friendly".
About The Process
MetalMUMPs incorporates all three major MEMS processes: LIGA-like, thick metal electroplating, as well as bulk and surface micromachining. Very tall structures of Nickel, between 18-22um, can be built on top of polysilicon and nitride with a deep, KOH-etched trench underneath. Electroplated nickel is used as the primary structural material and electrical interconnect layer. Doped polysilicon can be used for resistors, additional mechanical structures, and/or cross-over electrical routing. Silicon nitride is used as an electrical isolation layer. Deposited oxide (PSG) is used for the sacrificial layers. The trench layer in the silicon substrate can be incorporated for additional thermal and electrical isolation. Gold overplate can be used to coat the sidewalls of nickel structures with a low contact resistance material. The minimum feature size in MetalMUMPs is 5um.
Devices that can be made in MetalMUMPs include: Relays, Microfluidics, Magnetic Switches, and RF Devices.
Please click the links in the menu on the right for more detailed information on MetalMUMPs.
