SOIMUMPs

SOIMUMPs was introduced to the market in 2003. Unlike PolyMUMPs, the process for SOIMUMPs was an offspring of the MEMSCAP Variable Optical Attenuator product, though the process today has been refined to make it more "multi-user friendly".

About The Process

SOIMUMPs starts with a Silicon-On-Insulator(SOI) wafer, which consists of a stack of handle wafer(fixed 400um), buried oxide, and device wafer (25 µm thickness). Using one photolithography step on each side of the SOI wafer, SOIMUMPs allows the designer to pattern and etch both sides of the SOI wafer down to the buried oxide, enabling through-holes to pass light through. Two metal layers, one for bond pads and one for reflectivity, are included in the Standard Process. The minimum feature size in SOIMUMPs is 2um.

Devices that can be made in SOIMUMPs include: Gyros, Optical Devices, and Display Technologies.

Please click the links in the menu on the right for more detailed information on SOIMUMPs.

Office to Contact

North America:
Phone : +1 (919) 248-4102
Email: info@memscap.com
Contact Us

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